Electronic packaging
High-precision eutectic brazing furnace for chip, substrate and electronic package joining under vacuum or controlled atmosphere.
Vacuum Eutectic Brazing Furnace is offered as a configurable industrial furnace system. Share your material, working temperature, chamber size, atmosphere, loading weight and output target so the engineering team can confirm the suitable configuration.
Send package size, substrate material, eutectic alloy, bonding temperature and atmosphere requirement.
Send material, target temperature, chamber size, batch weight, vacuum or gas atmosphere, heating rate, cooling method and destination country. The engineering team can then recommend the right chamber, hot zone, loading method and budget range.